Display panel

ABSTRACT

A display panel is provided, which includes a first substrate, a first insulating layer on the first substrate, a semiconductor layer on the first insulating layer, and a second insulating layer on the semiconductor layer and the first insulating layer. The second insulating layer has a surface in contact with the first insulating layer. The second insulating layer has a first region. The first region has a thickness of 40 nm from the surface of the second insulating layer, and the second insulating layer has a fluoride ion gain ratio of 80% to 95% in the first region.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of pending U.S. patent applicationSer. No. 14/958,049,filed on Dec. 3, 2015 and entitled “Display panel”,which claims priority of Taiwan Patent Application No. 103144723, filedon Dec. 22, 2014, the entirety of which is incorporated by referenceherein.

BACKGROUND

Technical Field

The disclosure relates to a display panel.

Description of the Related Art

In a conventional deposition for an insulating layer (e.g. made ofsilicon oxide or silicon nitride), the deposition chamber should becleaned after repeated deposition steps. In general, the depositionchamber is cleaned by fluoride ions (F⁻), which are formed by treatingfluorine-containing gas (e.g. Ar+NF₃) with a remote plasma and thenconducted into the deposition chamber. However, the fluoride ions of thecleaning process will remain in the deposition chamber, and then aremixed in with the insulating layer deposited in a subsequent depositionprocess. The degree to which the fluoride ions accumulated on thesurface of the insulating layer will influence the semiconductordevice's performance. An overly high or overly low degree ofaccumulation will negatively influence performance, and should bemodified to improve the performance of the semiconductor device.

BRIEF SUMMARY

One embodiment of the disclosure provides a display panel, comprising: afirst substrate; a first insulating layer disposed on the firstsubstrate; a semiconductor layer disposed on the first insulating layer;and a second insulating layer disposed on the semiconductor layer andthe first insulating layer, wherein the second insulating layer has asurface in contact with the first insulating layer, wherein the secondinsulating layer has a first region, wherein the first region has athickness of 40 nm from the surface of the second insulating layer, andwherein the second insulating layer has a fluoride ion gain ratio of 80%to 95% in the first region.

One embodiment of the disclosure provides a display panel, comprising: afirst substrate; and a semiconductor layer disposed on the firstsubstrate; a first insulating layer disposed on the semiconductor layer;and a second insulating layer disposed on the first insulating layer,wherein the second insulating layer has a surface in contact with thefirst insulating layer, wherein the second insulating layer has a firstregion, wherein the first region has a thickness of 40 nm from thesurface of the second insulating layer, and wherein the secondinsulating layer has a fluoride ion gain ratio of 80% to 95% in thefirst region.

A detailed description is given in the following embodiments withreference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure can be more fully understood by reading the subsequentdetailed description and examples with references made to theaccompanying drawings, wherein:

FIGS. 1 to 3 show a process for depositing a second insulating layer inone embodiment of the disclosure;

FIG. 4 shows the result of a measurement of the SIMS in a first exampleand a second example of the disclosure;

FIGS. 5A-5C show thin film transistors in embodiments of the disclosure;

FIG. 6 shows thin film transistors in embodiments of the disclosure and

FIG. 7 shows a display panel in one embodiment of the disclosure.

DETAILED DESCRIPTION

The following description is of the best-contemplated mode of carryingout the disclosure. This description is made for the purpose ofillustrating the general principles of the disclosure and should not betaken in a limiting sense. The scope of the disclosure is bestdetermined by reference to the appended claims.

One embodiment provides a method for manufacturing a display panel. Asshown in FIG. 1, a remote plasma source 11 applies plasma tofluorine-containing chemical (e.g. Ar+NF₃) to form fluoride ions.Subsequently, the fluoride ions are conducted into the depositionchamber 13 to clean the deposition chamber 13.

The fluoride ions in the deposition chamber are then reduced, and afirst substrate 15 is then transferred into the deposition chamber 13.The first substrate 15 includes a first insulating layer 43 and asemiconductor layer 17 deposited thereon. In one embodiment, the firstsubstrate 15 can be a transparent rigid inorganic material (e.g. glass,quartz, or the like), an opaque rigid inorganic material (e.g. wafer,ceramic, or the like), or a flexible organic material (e.g. plastic,rubber, polyester, polyimide, polycarbonate, or the like). In oneembodiment, the first insulation layer 43 can be silicon oxide, siliconnitride, silicon oxynitride, or a combination thereof. The semiconductorlayer 17 can be amorphous silicon, poly silicon, indium-gallium-zincoxide (IGZO), indium-gallium-zinc-tin oxide (IGZTO), zinc oxide (ZnO),indium-zinc-tin oxide (IZTO), gallium-zinc oxide (GZO), or zinc-tinoxide (ZTO).

In one embodiment, the step of reducing the fluoride ions in thedeposition chamber 13 includes (1) vacuuming out the un-reacted fluorideions (and compounds formed of reactions of the fluoride ions) from thedeposition chamber 13 by a pump, and (2) depositing a fluoride ionabsorbing layer 14 on inner walls of the deposition chamber 13, as shownin FIG. 2. In general, the fluoride ion absorbing layer 14 and thesecond insulating layer 19 (See FIG. 3) should have the samecomposition, thereby avoiding the composition of the second insulatinglayer 19 being influenced by the composition of the fluoride ionabsorbing layer 14. For example, when the subsequently formed secondinsulating layer 19 includes silicon oxide, the fluoride ion absorbinglayer 14 will be silicon oxide too. When the subsequently formed secondinsulating layer 19 includes silicon nitride, the fluoride ion absorbinglayer 14 will be silicon nitride too. When the subsequently formedsecond insulating layer 19 includes silicon oxynitride, the fluoride ionabsorbing layer 14 will be a bi-layered structure of silicon nitride andsilicon oxide. However, the above embodiments are for illustration only.Alternatively, the fluoride ion absorbing layer 14 and the secondinsulating layer 19 can be composed of different materials. In differentembodiments, the fluoride ion absorbing layer 14 can be a silicon oxidelayer, a silicon nitride layer, or a bi-layered structure of siliconnitride and silicon oxide with a total thickness of 200 nm to 1000 nm.

Subsequently, a second insulating layer 19 is deposited on the firstinsulating layer 43 and the semiconductor layer 17, and the secondinsulating layer 19 has a surface 18 in contact with the firstinsulating layer 43. As described above, the second insulating layer 19can be silicon oxide, silicon nitride, silicon oxynitride, or acombination thereof. Because the fluoride ion absorbing layer 14 isdeposited on the inner walls of the deposition chamber 13 beforedepositing the second insulating layer 19, the fluoride ions on thedeposition chamber 13 are reduced during the deposition of the secondinsulating layer 19. As such, the accumulating concentration of thefluoride ions in the second insulating layer 19 at the surface 18 can beeffectively reduced.

In another embodiment, the semiconductor layer 17 is disposed betweenthe first insulating layer 43 and the first substrate 15. The followingsteps of forming the fluoride ion absorbing layer 14 and depositing thesecond insulating layer 19 are similar to the previously describedembodiment and the description thereof is omitted here.

In the following examples, secondary ion mass spectrometry (SIMS) wasused to measure the fluoride ion content in the second insulating layer19 corresponding to a non-display region of the first substrate.Although the measurement was performed in the non-display region of thefirst substrate, the second insulating layer was deposited on thedisplay region and the non-display region. As such, the fluoride iondistribution of the second insulating layer corresponding to thenon-display region should be similar to the fluoride ion distribution ofthe second insulating layer corresponding to the display region. Themeasurement factors in the examples are shown below:

Apparatus used: CAMECA IMS 6F

Source: Cs⁺

Energy: 15 KeV

Collected area (in diameter): 30 μm

The measurement result shows that the second insulating layer 19 haddifferent fluoride ion contents at different distances from the surface18. The unit of the fluoride ion signal intensity measured by the SIMSwas counts per second. The fluoride ion signal intensity wasinconsistent due to different types of ion source used in the detection.As such, the disclosure provides a method to measure the fluoride ioncontent that is not influenced by the different types of ion source usedin the detection, in which the fluoride ion signal intensity at a depthof the total measure region minus the fluoride ion background intensityequals the fluoride ion correction value at the depth. The fluoride ioncorrection values at all depths of the total measure region could beintegrated to obtain a fluoride ion gain value of the total measureregion. Furthermore, the fluoride ion correction values in apredetermined region of the total measure region were integrated toobtain a fluoride ion gain value of the predetermined region, whichcould be divided by the fluoride ion gain value of the total measureregion to obtain the fluoride ion gain ratio of the predeterminedregion. In the disclosure, the total measure region T was defined as aregion (in the second insulating layer) of 0 to 80 nm from the surface.In further detail definition, the total measure region T has a thicknessof 80 nm from the surface of the second insulating layer. The surface ofthe second insulating layer is in contact with the first insulatinglayer. The fluoride ion background intensity was defined as the lowestfluoride ion signal intensity measured in a second region B of thesecond insulating layer, and the second region B was 40 nm to 80 nm fromthe surface. In further detail definition, a first region A has athickness of 40 nm from the surface of the second insulating layer, thesecond region B has a thickness of 40 nm, and the second region B isbetween 40 nm to 80 nm from the surface of the second insulating layer.

In a first example, the fluoride ions in the deposition chamber 13 werevacuumed out, and a silicon oxide layer with a thickness of about 200 nmwas then deposited on inner walls of the deposition chamber 13, therebyreducing the fluoride ions in the deposition chamber 13. The fluorideions in the deposition chamber 13 were reduced before depositing asecond insulating layer 19, thereby reducing the fluoride ionconcentration of the second insulating layer 19 near the surface 18. Asshown in the result of a measurement of the SIMS in FIG. 4, a firstregion A of the second insulating layer 19 (0 nm to 40 nm from thesurface 18) had a maximum fluoride ion signal intensity of 1.79 E6(C/S). In further detail definition, the first region A has a thicknessof 40 nm from the surface of the second insulating layer. The surface ofthe second insulating layer is in contact with the first insulatinglayer. A second region B of the second insulating layer 19 (40 nm to 80nm from the surface 18) had a minimum fluoride ion signal intensityserving as a fluoride ion background intensity I_(B). The fluoride ionsignal intensity (solid line) was changed according to distances fromthe surface in the first example. The fluoride ion correction value wasthe fluoride ion signal intensity minus the fluoride ion backgroundintensity I_(B). The fluoride ion correction value in the first region A(0 nm to 40 nm from the surface 18) was integrated to obtain a fluorideion gain value of the first region A. The fluoride ion correction valuein the total measure region T (0 nm to 80 nm from the surface 18) wasintegrated to obtain a fluoride ion gain value of the total measureregion T. The fluoride ion gain value of the first region A was dividedby the fluoride ion gain value of the first region T to obtain afluoride ion gain ratio of the first region A, which was about 88% inthe first example. In other words, a fluoride ion gain ratio of thesecond region B (40 nm to 80 nm from the surface 18) was about 12%. Inaddition, if the thickness of the silicon oxide layer deposited on theinner walls of the deposition chamber was increased, the fluoride iongain ratio of the first region A would be further reduced. For example,if the thickness of the silicon oxide layer deposited on the inner wallsof the deposition chamber was about 1000 nm, the fluoride ion gain ratioof the first region A would be 82% and the fluoride ion gain ratio ofthe second region B would be 18%. In other words, the fluoride ion gainratio of the first region A and the fluoride ion gain ratio of thesecond region B had a ratio of about 4.6 to 7.3 when the silicon oxidewas selected as the fluoride ion absorbing layer 14.

In a second example, the fluoride ions in the deposition chamber 13 werevacuumed out, and a silicon nitride layer with a thickness of about 200nm was then deposited on inner walls of the deposition chamber 13,thereby reducing the fluoride ions in the deposition chamber 13. Becausethe fluoride ions in the deposition chamber 13 were reduced beforedepositing a second insulating layer 19, thereby reducing the fluorideion concentration of the second insulating layer 19 near the surface 18.As shown in the result of a measurement of the SIMS in FIG. 4, a firstregion A of the second insulating layer 19 (0 nm to 40 nm from thesurface 18) had a maximum fluoride ion signal intensity of 8.09 E5(C/S), and a second region B of the second insulating layer 19 (40 nm to80 nm from the surface 18) had a minimum fluoride ion signal intensityserving as a fluoride ion background intensity I_(C). In FIG. 4, I_(B)and I_(C) are nearly overlapping. The fluoride ion signal intensity(dashed line) was changed according to distances from the surface in thesecond example. The fluoride ion correction value was the fluoride ionsignal intensity minus the fluoride ion background intensity I_(C). Thefluoride ion correction value in the first region A (0 nm to 40 nm fromthe surface 18) was integrated to obtain a fluoride ion gain value ofthe first region A. The fluoride ion correction value in the totalmeasure region T (0 nm to 80 nm from the surface 18) was integrated toobtain a fluoride ion gain value of the total measure region T. Thefluoride ion gain value of the first region A was divided by thefluoride ion gain value of the first region T to obtain a fluoride iongain ratio of the first region A, which was about 95% in the secondexample. In other words, a fluoride ion gain ratio of the second regionB (40 nm to 80 nm from the surface 18) was about 5%. Similarly, if thethickness of the silicon nitride layer deposited on the inner walls ofthe deposition chamber was increased, the fluoride ion gain ratio of thefirst region A would be further reduced. For example, if the thicknessof the silicon nitride layer deposited on the inner walls of thedeposition chamber was about 1000 nm, the fluoride ion gain ratio of thefirst region A would be 88% and the fluoride ion gain ratio of thesecond region B would be 12%. In other words, the fluoride ion gainratio of the first region A and the fluoride ion gain ratio of thesecond region B had a ratio of about 7.3 to 19.0 when the siliconnitride was selected as the fluoride ion absorbing layer 14.

In third example, the fluoride ions in the deposition chamber 13 werevacuumed out, and a bi-layered structure of silicon oxide and siliconnitride with a total thickness of about 200 nm was then deposited oninner walls of the deposition chamber 13, thereby reducing the fluorideions in the deposition chamber 13. The fluoride ions in the depositionchamber 13 were reduced before depositing a second insulating layer 19,thereby reducing the fluoride ion concentration of the second insulatinglayer 19 near the surface 18. As shown in the result of a measurement ofthe SIMS, a first region A of the second insulating layer 19 (0 nm to 40nm from the surface 18) had a maximum fluoride ion signal intensity of2.57 E6 (C/S), the fluoride ion gain ratio of the first region A in thesecond insulating layer 19 (0 nm to 40 nm from the surface 18) was about83%, and the fluoride ion gain ratio of the second region B in thesecond insulating layer 19 (40 nm to 80 nm from the surface 18) wasabout 17%. Similarly, if the thickness of the bi-layered structure ofsilicon oxide and silicon nitride deposited on the inner walls of thedeposition chamber was increased, the fluoride ion gain ratio of thefirst region A would be further reduced. For example, if the thicknessof the bi-layered structure of silicon oxide and silicon nitridedeposited on the inner walls of the deposition chamber was about 1000nm, the fluoride ion gain ratio of the first region A would be 80% andthe fluoride ion gain ratio of the second region B would be 20%. Inother words, the fluoride ion gain ratio of the first region A and thefluoride ion gain ratio of the second region B had a ratio of about 4.0to 4.9 when the bi-layered structure of silicon oxide and siliconnitride was selected as the fluoride ion absorbing layer 14.

In summary, if a fluoride ion absorbing layer 14 is deposited on innerwalls of the deposition chamber 13 before depositing the secondinsulating layer 19 as illustrated in the first example to thirdexample, the fluoride ion concentration of the second insulating layer19 near the surface 18 will be reduced. According to electricalmeasurements of first example to third example, the thin filmtransistors thereof had a threshold voltage of 0V to 1V and a magnetichysteresis value of 0V to 0.5V.

As shown in the result of a measurement of the SIMS, differentcompositions of the fluoride ion absorbing layer 14 can reduce theaccumulation of the fluoride ions near the surface 18 of the secondinsulating layer 19, and the difference between the differentcompositions is just the reduction degree. As described above, thefluoride ion gain ratio of the first region A in the second insulatinglayer 19 (0 nm to 40 nm from the surface 18) was about 80% to 83% whenthe bi-layered structure of silicon oxide and silicon nitride wasselected as the fluoride ion absorbing layer 14. The fluoride ion gainratio of the first region A in the second insulating layer 19 (0 nm to40 nm from the surface 18) was about 82% to 88% when the silicon oxidewas selected as the fluoride ion absorbing layer 14. The fluoride iongain ratio of the first region A in the second insulating layer 19 (0 nmto 40 nm from the surface 18) was about 88% to 95% when the siliconnitride was selected as the fluoride ion absorbing layer 14.

Accordingly, the fluoride ions in the deposition chamber 13 were reducedbefore depositing the second insulating layer 19 on the semiconductorlayer 17, thereby effectively reducing the fluoride ion concentration ofthe second insulating layer 19 near the surface 18. As such, the thinfilm transistor properties such as threshold voltage and magnetichysteresis value can be improved.

The described structure can be further applied in any type of thin filmtransistor. As shown in FIG. 5A, a thin film transistor 40A is abottom-gate structure. A gate electrode 41 and a first insulating layer43 are sequentially formed on a first substrate 15, and a semiconductorlayer 17 is then formed on the first insulating layer 43. Thesemiconductor layer 17 is then patterned to serve as a channel layer ofthe thin film transistor 40A. A source electrode 45A and a drainelectrode 45B are formed on two sides of the patterned semiconductorlayer 17 to electrically connect to two sides of the patternedsemiconductor layer 17 (i. e. the channel layer). Subsequently, a secondinsulating layer 19 is formed on the first insulating layer 43, thedrain electrode 45A, the drain electrode 45B, and the patternedsemiconductor layer 17. Before forming the second insulating layer 19,the fluoride ions in the deposition chamber 13 should be reduced asdescribed above.

As shown in FIG. 5B, a thin film transistor 40B is a bottom-gatestructure. A gate electrode 41 and a first insulating layer 43 aresequentially formed on a first substrate 15, and a source electrode 45Aand a drain electrode 45B are formed on the first insulating layeroverlying two sides of the gate electrode 41. Subsequently, asemiconductor layer 17 is formed on the above structure, and thenpatterned to serve as a channel layer of the thin film transistor 40B.The source electrode 45A and the drain electrode 45B are electricallyconnected to two sides of the patterned semiconductor layer 17. A secondinsulating layer 19 is then formed on the semiconductor layer 17, thesource electrode 45A, and the drain electrode 45B. Before forming thesecond insulating layer 19, the fluoride ions in the deposition chamber13 should be reduced as described above.

As shown in FIG. 5C, a thin film transistor 40C is a bottom-gatestructure. A gate electrode 41 and a first insulating layer 43 can besequentially formed on a first substrate 15, and a semiconductor layer17 is then formed on the first insulating layer 43. The semiconductorlayer 17 is then patterned to serve as a channel layer of the thin filmtransistor 40C. A second insulating layer 19 is then formed on thesemiconductor layer 17. Before forming the second insulating layer 19,the fluoride ions in the deposition chamber 13 should be reduced asdescribed above. The second insulating layer 19 is then patterned toexpose two sides of the semiconductor layer 17. Subsequently, a sourceelectrode 45A and a drain electrode 45B are formed to electricallyconnect to the two sides of the semiconductor layer 17, respectively.

As shown in FIG. 6, a thin film transistor 50B is a top-gate structure.A semiconductor layer 17 is formed, and an insulating layer is patternedto form a first insulating layer 43 covering a center part of thesemiconductor layer 17. Subsequently, a gate electrode 41 is formed onthe first insulating layer 43. A second insulating layer 19 is thenformed on the gate electrode 41 and two sides of the semiconductor layer17. The two sides of the semiconductor layer 17 are defined as a sourceregion 45A and a drain region 45B. Then, the second insulating layer 19is patterned to form two via holes for a source electrode 47A and adrain electrode 47B electrically contacting the source region 45A andthe drain region 45B. The second insulating layer 19 has a surface 18 incontact with the first substrate 15. Before forming the secondinsulating layer 19, the fluoride ions in the deposition chamber 13should be reduced as described above.

As shown in FIG. 7, the display panel in one embodiment further includesa second substrate 20 and a display medium 30 disposed between the firstsubstrate 15 and the second substrate 20. The display medium 30 can be aliquid crystal layer, inorganic light emitting diode or an OLED device.The second substrate 20 can be a transparent rigid inorganic material(e.g. glass, quartz, or the like) or a flexible organic material (e.g.plastic, rubber, polyester, polyimide, polycarbonate, or the like).

While the disclosure has been described by way of example and in termsof the preferred embodiments, it is to be understood that the disclosureis not limited to the disclosed embodiments. On the contrary, it isintended to cover various modifications and similar arrangements (aswould be apparent to those skilled in the art). Therefore, the scope ofthe appended claims should be accorded the broadest interpretation so asto encompass all such modifications and similar arrangements.

What is claimed is:
 1. A display panel, comprising: a first substrate; afirst insulating layer disposed on the first substrate; a semiconductorlayer disposed on the first insulating layer; and a second insulatinglayer disposed on the semiconductor layer and the first insulatinglayer, wherein the second insulating layer has a surface in contact withthe first insulating layer, wherein the second insulating layer has afirst region, wherein the first region has a thickness of 40 nm from thesurface of the second insulating layer, and wherein the secondinsulating layer has a fluoride ion gain ratio of 80% to 95% in thefirst region.
 2. The display panel as claimed in claim 1, wherein thesecond insulating layer has a fluoride ion gain ratio of 80% to 83% inthe first region.
 3. The display panel as claimed in claim 1, whereinthe second insulating layer has a fluoride ion gain ratio of 82% to 88%in the first region.
 4. The display panel as claimed in claim 1, whereinthe second insulating layer has a fluoride ion gain ratio of 88% to 95%in the first region.
 5. The display panel as claimed in claim 1, whereinthe fluoride ion gain ratio in the first region is an integral value ofa fluoride ion correction value in the first region divided by anintegral value of the fluoride ion correction value in a total measureregion which has a thickness of 80 nm from the surface of the secondinsulating layer.
 6. The display panel as claimed in claim 5, whereinthe fluoride ion correction value is a fluoride ion signal intensity ata depth of the second insulating layer minus a fluoride ion backgroundintensity, wherein the fluoride ion background intensity is a lowestfluoride ion signal intensity measured in a second region of the secondinsulating layer, and the second region has a thickness of 40 nm,wherein the second region is between 40 nm to 80 nm from the surface ofthe second insulating layer.
 7. The display panel as claimed in claim 1,further comprising: a gate electrode disposed between the firstsubstrate and the first insulating layer; and a source electrode and adrain electrode disposed on the first insulating layer and electricallyconnected to two sides of the semiconductor layer, respectively, whereinthe second insulating layer covers the first insulating layer, thesemiconductor layer, the source electrode, and the drain electrode. 8.The display panel as claimed in claim 1, further comprising: a gateelectrode disposed between the first substrate and the first insulatinglayer; and a source electrode and a drain electrode disposed on thefirst insulating layer, wherein the semiconductor layer is disposed onthe source electrode and the drain electrode and electrically connectedto the source electrode and the drain electrode.
 9. The display panel asclaimed in claim 1, further comprising: a gate electrode disposedbetween the first substrate and the first insulating layer; and a sourceelectrode and a drain electrode disposed on the second insulating layer,wherein the source electrode and the drain electrode penetrate thesecond insulating layer to electrically connect to two sides of thesemiconductor layer, respectively.
 10. The display panel as claimed inclaim 1, further comprising: a second substrate; and a display mediumdisposed between the first substrate and the second substrate.
 11. Adisplay panel, comprising: a first substrate; and a semiconductor layerdisposed on the first substrate; a first insulating layer disposed on acenter part of the semiconductor layer; and a second insulating layerdisposed on two sides of the semiconductor layer and the firstsubstrate, wherein the second insulating layer has a surface in contactwith the first substrate, wherein the second insulating layer has afirst region, wherein the first region has a thickness of 40 nm from thesurface of the second insulating layer, and wherein the secondinsulating layer has a fluoride ion gain ratio of 80% to 95% in thefirst region.
 12. The display panel as claimed in claim 11, wherein thesecond insulating layer has a fluoride ion gain ratio of 80% to 83% inthe first region.
 13. The display panel as claimed in claim 11, whereinthe second insulating layer has a fluoride ion gain ratio of 82% to 88%in the first region.
 14. The display panel as claimed in claim 11,wherein the second insulating layer has a fluoride ion gain ratio of 88%to 95% in the first region.
 15. The display panel as claimed in claim11, wherein the fluoride ion gain ratio in the first region is anintegral value of a fluoride ion correction value in the first regiondivided by an integral value of the fluoride ion correction value in atotal measure region which has a thickness of 80 nm from the surface ofthe second insulating layer.
 16. The display panel as claimed in claim15, wherein the fluoride ion correction value is a fluoride ion signalintensity at a depth of the second insulating layer minus a fluoride ionbackground intensity, wherein the fluoride ion background intensity is alowest fluoride ion signal intensity measured in a second region of thesecond insulating layer, and the second region has a thickness of 40 nm,wherein the second region is between 40 nm to 80 nm from the surface ofthe second insulating layer.
 17. The display panel as claimed in claim11, further comprising: a gate electrode disposed between the firstinsulating layer and the second insulating layer; and a source electrodeand a drain electrode on the second insulating layer and electricallyconnected to two sides of the semiconductor layer by penetrating thesecond insulating layer, respectively.
 18. The display panel as claimedin claim 11, further comprising: a second substrate; and a displaymedium disposed between the first substrate and the second substrate.